Features:

①Mix ratio:  Epon828:H-113=100:50

①Cure condition:  24hrs at room temperature.

Application:

1.Combined with liquid epoxy resin, suitable for electronic unit potting at R.T.

2.Combined with liquid or solvent-containing epoxy resin, suitable for middle and bottom floor coating.

Packing：

Packed in 200Kg/steel drum or 25Kg/plastic pail.

Note:

1. Avoid contact with skin an eyes. If contact with skin, wash immediately with soap and plenty of water. In case of contact with eyes, rinse immediately with plenty of water and seek medical advice.

2. The information above is just for customers’ reference. You should test before use. Would you have any further problems in application, please do not hesitate to contact our Sales Department immediately.